LED Light Guide Formulas

Demand for Power (kW) =System Input Wattage (W) ÷ 1,000
Energy Consumption (kWh) = System Input Wattage (kW) x Hours of Operation/Year
Hours of Operation/Year = Operating Hours/Day x Operating Days/Week x Operating Weeks/Year
Lighting System Efficacy (Lumens per Watt or LPW) = System Lumen Output ÷ Input Wattage
Unit Power Density (W/sq.ft.) = Total System Input Wattage (W) ÷ Total Area (Square Feet)
Watts (W) = Volts (V) x Current in Amperes (A) x Power Factor (PF)
Voltage (V) = Current in Amperes (A) x Impedance (Ohms) [Ohm's Law]

ECONOMIC FORMULAS
Simple Payback on an Investment (Years) = Net Installation Cost ($) ÷ Annual Energy Savings ($)
5-Year Cash Flow ($) = 5 Years - Payback (Years) x Annual Energy Savings ($)
Simple Return on Investment (%) = [Annual Energy Savings ($) ÷ Net Installation Cost ($)] x 100

DESIGN FORMULAS
Footcandles & Lumens
Footcandles (fc) = Total Lumens (lm) ÷ Area in Square Feet
1 Lux (lx) = 1 Footcandle (fc) x 10.76
Lux = Total Lumens ÷ Area in Square Meters

Calculating Light Level at a Point
For planes perpendicular to the direction of candlepower (Inverse Square Law):
Footcandles (fc) = I ÷ D²

I = Candlepower in candelas (cd) D = Direct distance between the lamp and the point where light level is calculated

Many workplanes are not perpendicular to the direction of light intensity, which is why calculating light level at a point is useful for such applications. In these cases, we often must determine light levels on workplanes that are not horizontal and perpendicular but tilted or even vertical. For tilted-horizontal or vertical planes:
Horizontal Footcandles (fc_h) = (I ÷ D²) x H
Vertical Footcandles (fc_v) = (I ÷ D²) x L

I = Candlepower in candelas (cd) D = Direct distance between the lamp and the point where light level is calculated
H = Distance between the lamp and the point direct below on the workplane
L = Distance between that point and the point where light level is being calculated
D = Square Root of (H² + L²) or D² = H² + L²

Calculating Average Light Level Throughout a Space (three formulas)

Average Maintained Illumination (Footcandles) = (Lamps/Fixture x Lumens/Lamp x No. of Fixtures x Coefficient of Utilization x Light Loss Factor) ÷ Area in Square Feet Average Maintained Illumination (Footcandles) = (Total Lamps x Lumens/Lamp x Coefficient of Utilization x Light Loss Factor) ÷ Area in Square Feet
Average Maintained Illumination (Footcandles) = (Lamps in One Fixture x Lumens/Lamp x Coefficient of Utilization x Light Loss Factor) ÷ Area in Square Feet/Fixture

Lumen Method
Required Light Output/Fixture (Lumens) = (Maintained Illumination in Footcandles x Area in Square Feet) ÷ (Number of Fixtures x Coefficient of Utilization x Ballast Factor x Light Loss Factor)

Light Loss Factors (more on Light Loss)
Light Loss Factor (LLF) = Ballast Factor x Fixture Ambient Temperature Factor x Supply Voltage Variation Factor x Lamp Position Factor x Optical Factor x Fixture Surface Depreciation Factor x Lamp Burnouts Factor x Lamp Lumen Depreciation Factor x Fixture Dirt Depreciation Factor x Room Surface Dirt Depreciation Factor
Lamp Burnout Factor = 1 - Percentage of Lamps Allowed to Fail Without Being Replaced

Zonal Cavity Method (determining cavity ratios)

Room Cavity Ratio (for regular rooms shaped like a square or rectangle) = [5 x Room Cavity Depth x (Room Length + Room Width)] ÷ (Room Length x Room Width) Room Cavity Ratio (for irregular-shaped rooms) = (2.5 x Room Cavity Depth x Perimeter) ÷ Area in Square Feet
Ceiling Cavity Ratio = [5 x Ceiling Cavity Depth x (Room Length x Room Width)] ÷ (Room Length x Room Width)
Floor Cavity Ratio = [5 x Floor Cavity Depth x (Room Length x Room Width)] ÷ Room Length x Room Width

Room surface reflectances can be predicted in a new design or measured in an existing facility. If existing facility:

Room Surface Reflectance (%) = Reflected Reading ÷ Incident Reading Reflected Reading = Measurement from a light meter holding it about 1.5 feet away from the surface with the sensor parallel and facing the surface.
Incident Reading = Measurement from a light meter held flat against the surface and facing out into the room.

Calculating Number of Lamps And Fixtures And Spacing
Required No. of Fixtures = (Lumens/Lamp x No. of Lamps x Coefficient of Utilization x Light Loss Factor x Area in Square Feet) ÷ (Lumens/Lamp x Lamps/Fixture x Coefficient of Utilization x Light Loss Factor)
Required Lamps = Required Lumens ÷ Initial Lumens/Lamp
Maximum Allowable Spacing Between Fixtures= Fixture Spacing Criteria x Mounting Height

Fixture Spacing Criteria: See the manufacturer's literature Mounting height: Distance in feet between the bottom of the fixture and the workplane

Spacing Between Fixtures = Square Root of (Area in Square Feet ÷ Required No. of Fixtures)
Number of Fixtures to be Placed in Each Row (N_row) = Room Length ÷ Spacing
Number of Fixtures to be Placed in Each Column (N_column) = Room Width ÷ Spacing

For the above two formulas, round results to the nearest whole integer.

Spacingrow = Room Length ÷ (Number of Fixtures/Row - 1/3)
Spacingcolumn = Room Width ÷ (Number of Fixtures/Column -1/3)

If the resulting number of fixtures does not equal the originally calculated number, calculate impact on the designed light level:
% Design Light Level = Actual No. of Fixtures ÷ Originally Calculated No. of Fixtures

To calculate fixtures mounted in continuous rows:
Number of Luminaires in a Continuous Row = (Room Length ÷ Fixture Length) - 1
Number of Continuous Rows = Total Number of Fixtures ÷ Fixtures Per Row

MAINTENANCE
Lamp Life
Calendar Lamp Life (Years) = Rated Lamp Life (Hours) ÷ Annual Hours of Operation (Hours/Year)

Lamp Burnout Factor
Lamp Burnout Factor = 1 - Percentage of Lamps Allowed to Fail Without Being Replaced

Group Relamping Cost
Annualized Cost ($) = A x (B + C)
A = Operating Hours/Year ÷ Operating Hours Between Relampings
B = (Percentage of Lamps Failing Before Group Relamping x Number of Lamps) x (Lamp Cost + Labor Cost to Spot Replace 1 Lamp)
C = (Lamp Cost, Group Relamping + Labor Cost to Group Relamp 1 Lamp) x Number of Lamps

Spot Relamping Cost
Average Annual Cost ($) = (Operating Hours/Year ÷ Rated Lamp Life) x (Lamp Cost + Labor Cost to Replace 1 Lamp) x Total Number of Lamps

Cleaning Cost
Cleaning Cost ($) = Time to Wash 1 Fixture (Hours) x Hourly Labor Rate ($) x Number of Fixtures in Lighted Space

ENVIRONMENTAL IMPACT
Average Reduced Air Pollution (lbs. Carbon Dioxide) = Energy Savings (kWh) x 1.6 lbs.
Average Reduced Air Pollution (g. Sulphur Dioxide) = Energy Savings (kWh) x 5.3 g.
Average Reduced Air Pollution (g. Nitrogen Oxides) = Energy Savings (kWh) x 2.8 g.
Pounds = Grams ÷ 454
Tons = Pounds ÷ 2,000

Source: http://www.ledaladdin.com/light_guides/led_light_guide_formulas.html

The Chip-on-Board (COB) LED Module

The Chip-on-Board (COB) LED Module

LED technology offers better color mixing and simplified thermal management for backlighting large LCD displays.

Conventionally, LED chips have been mounted on substrates to create discrete LED components, which were attached to a printed circuit board. The solder reflow process typically used to attach the component to the circuit board subjects the LED chip to a substantial amount of heat that easily can damage the chip or degrade its performance. Hence, tight (and, therefore, expensive) process control is required for this type of assembly. In fact, the substrate cost is almost invariably the second-highest in an LED component, exceeded only by the cost of the chip itself.

A different approach, called chip-on-board packaging, seems capable of meeting all the requirements of backlighting. This method mounts the LED chip directly onto the printed circuit board using a conductive adhesive, which helps reduce costs by eliminating the substrate and complicated solder reflow assembly process. In addition, direct attachment can reduce the pitch between LED chips from the conventional 5 mm to approximately 2 mm and can lower the overall height of the light source (Figure 1).

Figure 1. By mounting the LED directly onto the printed circuit board, a substrate is unnecessary, so pitch is reduced from 5 mm to approximately 2 mm.

Decreasing the LED pitch reduces the color-mixing area required (Figure 2), which means that the area of light loss is smaller. To achieve high coupling efficiency from the light source to the lightguide plate, a reflector is incorporated into the chip-on-board package to produce an oval radiation pattern. A narrow radiation pattern on the X-axis allows more light to enter the lightguide plate, whereas a wider radiation angle on the Y-axis enhances color mixing.

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Figure 2. Reducing the pitch decreases the size of the color-mixing area.


Simple thermal management

A metal core printed circuit board is used in the package to provide a low thermal resistance, allowing heat generated by the LED chip to be transferred to the heat sink via the shortest possible thermal path (Figure 3), which increases the life span; moveover, the heat transfers more efficiently through three layers than through five. The chip-on-board packages are mounted directly onto the back metal (with thermal compound at the interface), so that the heat generated by the LED chips spreads efficiently on the large metal frame for efficient dissipation without additional heat sinking. In the demonstration configuration, the entire backlight unit can maintain a temperature below 60°.



Figure 3. In comparison with the conventional approach, the thermal path is reduced. (DA = die attach, MCPCB = metal core printed circuit board.)

When compared with assemblies using conventional discrete LED packages, a chip-on-board approach can be compared with RGB LED-based LCD backlighting. The chip-on-board leds packaging has a thin outline, it produces better color mixing, and it requires simple thermal management and potentially lowers costs, all of which better match the requirements of customers. In addition, assembling a complete backlight using the chip-on-board led package is similar to that using today fluorescent lamps, which makes a changeover relatively simple.

Source: http://www.ledaladdin.com/led_technology/chip_on_board_leds.html

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